Apple’s A20 chip may redefine performance for iPhone 18 Pro and 18 Fold

The iPhone 17 is still months away from launch, but attention is already turning to Apple’s next leap in chip technology. The upcoming A20 chip, expected to power the iPhone 18 Pro and Apple’s long-rumored foldable iPhone, could deliver one of the most significant performance upgrades in recent years.

According to analyst Jeff Pu, the A20 will be Apple’s first chip built using TSMC’s advanced 2-nanometer process. This transition from the current 3-nanometer architecture could lead to noticeable gains in speed and efficiency, with early estimates pointing to up to 15 percent faster performance and 30 percent lower power consumption compared to the A19.

Beyond the manufacturing process, the A20 may introduce a new packaging design that brings core components closer together. Apple is reportedly planning to use Wafer-Level Multi-Chip Module packaging, which integrates the CPU, GPU, Neural Engine, and memory onto the same wafer. This could reduce latency, improve thermal management, and shrink the chip’s overall footprint.

For the iPhone 18 Fold, in particular, these changes could be game-changing. A smaller and more efficient chip would free up internal space, possibly allowing for larger batteries or more advanced internal components in a compact form factor. The packaging shift could also support faster on-device AI processing, an increasingly important feature as Apple pushes forward with its Apple Intelligence platform.

If the A20 lives up to expectations, it will represent more than just another annual performance boost. It could mark a new chapter in how Apple designs the internal architecture of its devices. The iPhone 18 Pro and Fold, expected in late 2026, may be Apple’s most advanced smartphones yet, reshaped from the inside out.